Semiconductor - Composite Sealing Systems Division | Parker US
ultra high purity and low permeability seals for semiconductor fabrication tools

For today's semiconductor market, contamination control is critical to maximizing device yields. Advanced sealing prevents increasingly smaller particles from impacting yield. As particle budgets continue to decrease, Parker understands the need for ultra high purity (UHP) components in fabrication tool applications. 

Semiconductor Sealing Technology Solutions

Using ultra pure materials and cleanroom manufacturing protocols in expertly controlled process conditions, we manufacture highly engineered bespoke UHP O-rings and composite sealing solutions for semiconductor fabrication tools.

In addition to offering the most advanced homogenous elastomeric materials and O-ring solutions, we've perfected zero bond deformation technology to vulcanize UHP elastomers to thermoplastic or metal substrates. 

Ultra high purity (UHP) elastomers for semiconductor metal deposition, load locks and vacuum applications

Ultra High Purity (UHP) Seal Elastomers

Parker's ULTRA™ perfluorinated elastomers (FFKM) offer excellent compression set resistance and superior thermal stability. The ULTRA elastomers are the ideal sealing solution for semiconductor fabrication processes at sustained temperature extremes and harsh chemistries.

Parker’s FKM elastomers excel in challenging high pressure and vacuum conditions making them the premier choice for metal deposition, load locks, and other vacuum applications.  

zero deterioration bonded sealing technology for extreme temperatures

Zero Deterioration Bond Strength

Parker's materials experts and process engineers have developed bonding and molding technolocgies to produce sealing systems in which bonding strength sees zero deterioration with ULTRA FFKM up to 250°C –including enhanced bond strength retention beyond 250°C, delivering unparalleled performance even at sustained temperature extremes.

O-Ring and Static Elastomeric Seal Solutions

For service conditions in the semiconductor market, Parker is continuously developing next generation compounds that maximize chip output and decrease down time, thereby improving MTBF and COO.

animation of o-rings for semiconductor wafer and chip fabs

Evolve™ Plasma Resistant PTFE-FFKM Composite Seals

Using the integrated PTFE shield as its plasma barrier, Parker's patented Evolve™ sealing technology delivers unparalleled plasma resistance and phenomenal seal cleanliness by situating the PTFE shield exactly where plasma attack is its harshest, whether it be on its ID, OD, radial faces, or some combination thereof.

Evolve composite seals for plasma attack resistance in semiconductor fabrication tools

Metal Seals for Semiconductor Applications

Parker’s metal sealing solutions offer high-performance sealing in environments where polymeric and elastomeric seals will fail due to high (or low) temperature or high pressure. Parker offers numerous cutting-edge materials to withstand the most punishing environments in highly customized configurations to meet exacting application requirements.
 

Parker’s metal seals can be electroplated for optimal sealing for a range of applications, all the way from Helium or Hydrogen gas to more corrosive fluid media.

Resilient metal seals for semiconductor fabrication equipment and tools

Dramatically extend seal life

Slit Valve and Gate Valve Door Seals

Continuing to extend seal life dramatically over the OEM door design, the Parker UHP gate valve door unites the strengths of Parker-exclusive UHP elastomers, advanced bonding technology and a uniquely engineered sealing element to decrease particle generation and increase resistance against dynamic mechanical wear and chemical attack.
 

At the forefront of slit valve door innovation since their design inception, Parker continues to reduce total cost of ownership with our engineered seal designs and bonding technology, dramatically lowering particle count and increasing seal life (10x) versus conventional doors and OEM bonded doors.

slit valve doors and gate valve doors for semiconductor fabrication tools

Semiconductor fabrication

Proven Sealing Technologies

Parker advanced bonding technology has engineered successes in the most critical applications:

  • Slit valve and gate valve doors
  • L-motion slit valve doors
  • Pendulum valve doors
  • Slit valve door bumpers
  • Electro-chemical deposit contact rings
  • Wafer transport end effectors
  • Evolve™ PTFE-FFKM composite seals
  • Gas and liquid manifolds replacing multiple o-rings
  • Metal seals
Semiconductor fabrication tool clean manufacturing

Robust design extends uptime

Pendulum Valve Door Seals

Parker’s vacuum pendulum seal technology increases the plasma resistance and mechanical robustness of the pendulum seal insert.

 

Performance all starts with Parker’s ULTRA & HIFLUOR material with ultra-high purity, excellent sealing and mechanical properties.

 

Advance bonding technology that prolongs seal life and reduces seal mechanical degradation by eliminating loose o-rings in a dovetail groove. Parker’s custom-engineered seal profile optimizes sealing stresses, mechanical loading, and dynamic sealing force retention contributing to longer seal uptime before a leak or particle excursion. Additionally, Parker’s pendulum seal product creates ease and speed of maintenance as well as consolidation of part number management.

pendulum valve door seals for semiconductor fabrication tools



Are you in search of thermal packaging materials for GaN and SiC wide bandgap semiconductors?

Common products for GaN and SiC wide bandgap semiconductor thermal management include:

 

  • Heat spreaders
  • Die tabs
  • Baseplates
  • Pedestals
  • Shims
  • Thermal inserts
  • Material blanks
  • PCB coins
  • Lids
  • Housings
  • Carriers
  • Cold plates
  • Integrated constructions