Using ultra pure materials and cleanroom manufacturing protocols in expertly controlled process conditions, we manufacture highly engineered bespoke UHP O-rings and composite sealing solutions for semiconductor fabrication tools.
In addition to offering the most advanced homogenous elastomeric materials and O-ring solutions, we've perfected zero bond deformation technology to vulcanize UHP elastomers to thermoplastic or metal substrates.
Parker's ULTRA™ perfluorinated elastomers (FFKM) offer excellent compression set resistance and superior thermal stability. The ULTRA elastomers are the ideal sealing solution for semiconductor fabrication processes at sustained temperature extremes and harsh chemistries.
Parker’s FKM elastomers excel in challenging high pressure and vacuum conditions making them the premier choice for metal deposition, load locks, and other vacuum applications.
Parker's materials experts and process engineers have developed bonding and molding technolocgies to produce sealing systems in which bonding strength sees zero deterioration with ULTRA FFKM up to 250°C –including enhanced bond strength retention beyond 250°C, delivering unparalleled performance even at sustained temperature extremes.
For service conditions in the semiconductor market, Parker is continuously developing next generation compounds that maximize chip output and decrease down time, thereby improving MTBF and COO.
Using the integrated PTFE shield as its plasma barrier, Parker's patented Evolve™ sealing technology delivers unparalleled plasma resistance and phenomenal seal cleanliness by situating the PTFE shield exactly where plasma attack is its harshest, whether it be on its ID, OD, radial faces, or some combination thereof.
Parker’s metal sealing solutions offer high-performance sealing in environments where polymeric and elastomeric seals will fail due to high (or low) temperature or high pressure. Parker offers numerous cutting-edge materials to withstand the most punishing environments in highly customized configurations to meet exacting application requirements.
Parker’s metal seals can be electroplated for optimal sealing for a range of applications, all the way from Helium or Hydrogen gas to more corrosive fluid media.
Dramatically extend seal life
Continuing to extend seal life dramatically over the OEM door design, the Parker UHP gate valve door unites the strengths of Parker-exclusive UHP elastomers, advanced bonding technology and a uniquely engineered sealing element to decrease particle generation and increase resistance against dynamic mechanical wear and chemical attack.
At the forefront of slit valve door innovation since their design inception, Parker continues to reduce total cost of ownership with our engineered seal designs and bonding technology, dramatically lowering particle count and increasing seal life (10x) versus conventional doors and OEM bonded doors.
Semiconductor fabrication
Parker advanced bonding technology has engineered successes in the most critical applications:
Robust design extends uptime
Parker’s vacuum pendulum seal technology increases the plasma resistance and mechanical robustness of the pendulum seal insert.
Performance all starts with Parker’s ULTRA & HIFLUOR material with ultra-high purity, excellent sealing and mechanical properties.
Advance bonding technology that prolongs seal life and reduces seal mechanical degradation by eliminating loose o-rings in a dovetail groove. Parker’s custom-engineered seal profile optimizes sealing stresses, mechanical loading, and dynamic sealing force retention contributing to longer seal uptime before a leak or particle excursion. Additionally, Parker’s pendulum seal product creates ease and speed of maintenance as well as consolidation of part number management.
Advanced thermal packaging materials for GaN and SiC wide bandgap semiconductors is a key technology driver for optimal device performance and reliability. High thermal conductivity low thermal expansion copper diamond metal matrix composites (MMCs) enable passive heat transfer in commercial and defense systems.
Thermally isotropic components (650 W/m°K) up to 6” long x 4” wide ranging from ≥ 0.010” to 2” thick are currently offered by Parker.
Eliminating the sources of defects is a tedious but necessary process to improve wafer yield in semiconductor fabrications. One very distinct source of defects is the seals within a fab’s tool. Plasmas involved in both deposition, etch and cleaning utilize aggressive chemistries that put even high-functioning perfluorinated compounds to the test.
Read how Parker worked with the customer to improve challenges with mechanical breakdown of bonded gates on angled lengths of seal to increase wafer yield by five times or more.
For semiconductor applications, a critical consideration for choosing a seal material is a phenomenon known as “outgassing”. However, even within the elastomer community, outgassing is not something that is commonly considered. Thus the questions: What is outgassing, and Why is it important?
In the semiconductor market, cleanliness and performance of seals is paramount in maximizing chip output and decreasing down time.
View our recommendations for utilizing Parker FFKM HiFluor and ULTRA elastomers for a range of semiconductor fabrication processes including, etch, plasma & gas deposition, thermal, wet.