Empowering High-Speed I/O Data Connections with Advanced EMI Shielding Solutions

This scenario introduces a double-edged sword for electromagnetic interference (EMI) shielding. First, as data rates increase, EMI shielding requirements also increase. Maintaining signal integrity and enabling high-speed data transfers requires robust shielding to protect against EMI and radio frequency interference (RFI). 

The second challenge is associated with cable design. High-quality materials and greater wire density are needed for greater transfer speeds, limiting the space available for EMI shielding solutions at the cable level. Even very small gaps within the cables may need to be shielded, and in some cases, it’s necessary to separate the cables from each other using gaskets or ink to ensure there’s no interference. Despite having less space allocated to it, EMI shielding must still be extremely high performing as well as suitable for production in high-volume manufacturing situations. 

Just as important as the cable assemblies are the connectors. High speed backplane connectors are reaching speeds of 112 or even 224 GB/s with the integration of hundreds of differential pairs. Each pair must be shielded or isolated, providing the challenge of integrating high conductivity shielding solutions with high precision manufacturing for very thin wall gasket solutions. Optical transceivers also require shielding, needing solutions for very small gaps in transceiver body or outer casing design. 

Data centers and the IT industry are not alone in requiring detailed attention to cable and connector solutions with respect to EMI shielding. Parker Chomerics engineers are experts at 5G mmWave EMI shielding that keep base stations, towers, and the associated network equipment performing at their best to keep critical communication going.

For even smaller spaces or cable separation, our electrically conductive paints and coatings deliver critical EMI/RFI shielding on plastic and composite housings of electronic assemblies. Suitable for use across a diverse range of applications, there are many options to choose from including electrically conductive filler and binder configurations, each designed for durable, reliable and high performing EMI/RFI shielding in various applications. 

One of these high-performing coatings is PRO-SHIELD, a single-component electrically conductive ink that enables high electrical conductivity and ensures strong adhesion to various substrates, including plastic and composites. It is loosely cross-linked and cures flexibly as opposed to compounds that are brittle upon full cure. It is designed with viscosity properties in mind, proving low enough viscosity for ease of dispensing and high enough viscosity to form a bead that can be mated to connectors and cables.  

Cabling and connectors for data center and high-speed data transfer applications must be future proof. We can only expect these EMI shielding challenges to increase in the future as we continue to push the envelope to expand the bandwidth of wireless infrastructure and other data transfer solutions. That’s why we’re constantly searching for ways to optimize and expand our catalog of EMI shielding and thermal management solutions so we’ll be ready as technology evolves. 

As data center technology continues to advance, you can trust Parker Chomerics to be ready with proven, high-performance solutions. 

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