Extremely high temperatures are a given with advanced 5G applications, requiring thermal materials that can stand up to that environment. Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
High temperatures introduce an increased risk of corrosion, and it’s important to choose EMI shielding materials that were specifically tested for this risk. CHO-SEAL® 6502 conductive elastomer gasket are an excellent choice, meeting shielding requirements of more than 100dB. CHO-SEAL 6502 provides the highest performance in harsh environments and is the best choice for corrosion requirements against aluminum.
There’s a lot riding on advanced 5G applications, and it’s crucial that the thermal products used within them can be counted on for the long haul. That’s why all products from Parker Chomerics endure high-frequency testing at 5G wavelengths and beyond. We don’t leave it up to our customers to figure out if things will work; we give them data based on 3GPP standards so they can make informed decisions for their applications.
Peace of mind – that’s the Parker Chomerics advantage.
Advanced 5G applications are complicated devices supported by high-performing, interconnected internal systems. Parker Chomerics is fluent in this space and can provide EMI shielding and thermal management solutions across the entire device. By sourcing all required products from one reliable partner, you can streamline procurement timelines and minimize potential supply chain disruptions.
7.5 W/m-K Thermal Conductivity One Component Fully Cured TIM
Eliminating the need for multiple thermal gap filler pad part sizes, THERM-A-GAP GEL 75 is a single-component, dispensable thermal gap filler that requires no curing and can be dispensed over a heat generating component for effective cooling.
High Temperature Electrically Conductive Foam EMI Shielding Gaskets
Designed for indoor applications, SOFT-SHIELD 4860 is based on the unique integration of electrically conductive silver-plated nylon fibers into a low-density silicon foam, providing a performance-driven, cost-effective EMI shielding solution.
Electrically Conductive Form-In-Place Material Gaskets
When a cost-effective solution is needed, CHO-FORM robotically dispensed form-in-place (FIP) EMI shielding gaskets provide the lowest total cost of ownership for small cross section and complex pattern applications, reducing the installed cost of an EMI gasket by up to 60%.
Electrically Conductive Form-In-Place Material Gaskets
Parker Chomerics CHO-MUTE elastomer based absorber materials are designed to offer a user friendly approach to the reduction of unwanted electromagnetic radiation from electronic equipment as well as minimize cavity to cavity cross coupling, and microwave cavity resonances.
Injection Molded Plastic Solutions
Parker Chomerics PREMIER ‘single pellet’ electrically conductive plastic pellets offer superior performance and consistency when compared to many conductive plastic materials and utilize long-fiber pultrusion to ensure uniform amounts of conductive filler are in each pellet.
Quality and consistency of every part is paramount to ensuring they do their job time after time, day after day. And the people who count on our parts and materials need to rest assured that they are functioning properly, freeing the operators or beneficiaries to do other tasks or simply live their lives worry-free.
Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.