Bonded Technology Solutions
We've perfected zero bond deformation technology to vulcanize UHP elastomers to thermoplastic or metal substrates.
Using ultra pure materials and cleanroom manufacturing protocols iin expertly controlled process conditions, we manufacture highly engineered bespoke UHP composite sealing solutions for semiconductor fabrication tools.
Zero Deterioration Bond Strength
Parker's materials experts and process engineers have developed bonding and molding technolocies to produce sealing systems in which bonding strength sees zero deterioration with ULTRA FFKM up to 250°C –including enhanced bond strength retention beyond 250°C, delivering unparalleled performance even at sustained temperature extremes.
Ultra High Purity (UHP) Elastomers
Parker's ULTRA™ perfluorinated elastomers offer excellent compression set resistance and superior thermal stability.
Their compatibility with a wide range of harsh chemistries and rating for use in challenging high pressure and vacuum conditions making them the ideal sealing solution for semiconductor fabrication processes.at sustained temperature extremes.
Semiconductor fabrication
Proven Application Successes
Parker advanced bonding technology has engineered successes in the most critical applications:
- Slit valves
- Gate valves
- Isolation, poppet, and throttle valves
- Electro-chemical deposition rings
- End effector wafer transports
- Gas and liquid manifolds replacing multiple o-rings
- Low-closure force atmospheric sealing factory interfaces
Dramatically extend seal life
UHP Gate Valve Doors
Continuing to extend seal life dramatically over the OEM door design, the Parker UHP gate valve door unites the strengths of Parker exclusive UHP elastomers, advanced bonding technology and a uniquely engineered sealing element to decrease particle generation and increase resistance against dynamic mechanical wear and chemical attack.
Optimize wafer contact
End Effectors
Used in the transfer of wafers, either by vacuum or by friction, our end effectors feature a custom engineered seal chemically bonded to the end effector blade. The bonded seal is engineered to reduce particle generation and optimize wafer contact area, ensuring consistent wafer transfer, cycle after cycle.
Lower particle count
UHP Slit Valve Doors
At the forefront of slit valve door innovation since their design inception, Parker continues to reduce total cost of ownership with our engineered seal designs and bonding technology, dramatically lowering particle count and increasing seal life (10x) versus conventional doors and OEM bonded doors.
Integral Seals™
Electrochemical Plating Contact Ring Solutions
These seals are engineered to optimize wafer-edge exclusion and provide repeatable sealability during the electrochemical plating process. The design consists of low-extractable Parker ultra-high purity (UHP) elastomers chemically bonded to thermoplastic or corrosion-resistant metal rings, exemplifying Parker’s superior bonding technology.
More Information
Low Particle Generation & Extreme Etch Resistant FFKM
Eliminating the sources of defects is a tedious but necessary process to improve wafer yield in semiconductor fabrications. One very distinct source of defects is the seals within a fab’s tool. Plasmas involved in both deposition, etch and cleaning utilize aggressive chemistries that put even high-functioning perfluorinated compounds to the test.
Case Study: UHP Gate Valve Door
Read how Parker worked with the customer to improve challenges with mechanical breakdown of bonded gates on angled lengths of seal to increase wafer yield by five times or more.
Blog: Outgassing - Why It's Critical
For semiconductor applications, a critical consideration for choosing a seal material is a phenomenon known as “outgassing”. However, even within the elastomer community, outgassing is not something that is commonly considered. Thus the questions: What is outgassing, and Why is it important?
Semiconductor Seal Materials Guide
In the semiconductor market, cleanliness and performance of seals is paramount in maximizing chip output and decreasing down time.
View our recommendations for utilizing Parker FFKM HiFluor and ULTRA elastomers for a range of semiconductor fabrication processes including, etch, plasma & gas deposition, thermal, wet.