Sealing Solutions for Data Centers - O-Ring & Engineered Seals Division | Parker US
Battery Energy Storage Systems (BESS)

Data Center Sealing Solutions

As chip manufacturers push the limits of processor performance, traditional air cooling systems fall short, leading the electronics industry to embrace liquid cooling solutions for data centers. Parker offers high-quality sealing solutions—such as EPDM O-rings, press-in-place seals, and overmolded gaskets—designed to prevent leakage and enhance reliability in sensitive environments. With fast, local engineering and manufacturing, our durable seals ensure optimal performance and longevity, helping you maximize efficiency in the evolving landscape of data center technology.

Data Center Sealing Solutions

WHITE PAPER & PRODUCT APPENDIX

As data centers face escalating temperatures due to advanced technology and multi-core chips, traditional cooling methods are no longer sufficient. This whitepaper explores the shift towards liquid cooling systems, highlighting the critical role of reliable sealing solutions in ensuring leak-free operation. Discover how innovative materials and designs are transforming thermal management in data centers.

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Sealing Solutions Brochure

BROCHURE

Shape and fit matter. Explore the breadth of our standard and custom sealing product offering. From standard O-rings to custom molded shapes and dispensable elastomers, we have the sealing solutions to fit the needs of your cold plate applications and more.  

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Operate & Maintain Cooling System Integrity with Leak-Free Seals

ANIMATION

Parker offers sealing solutions for your critical data center applications, ensuring the integrity of the cooling system with leak-free seals. Not only do we provide the elastomeric technology you need, but also custom shapes for flexibility in your specific cold plate applications.

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Not sure which solution you need? Talk with one of our experts.