TIM thermal interface materials play an important role in protecting equipment and devices from high internal temperatures. Often placed between the heat-generating chip or component and the heat-spreading layer, TIM helps safeguard electronic devices by dissipating or improving heat transfer out of them. Additionally, TIM provides shielding from damaging electromagnetic interference.
TIMs have applications across many industries, from automotive to defense aerospace and telecom. They are an important part of equipment maintenance and optimal device performance, protecting sensitive equipment from potentially damaging high temperatures by filling the small pockets of air between components and casings.
For example, they are an essential part of advanced driver-assistance system (ADAS) components, such as back-up cameras and sensors that aim to reduce the number of car accidents or minimize the impact of those that can’t be avoided. Each of these safety devices has its own computer with many small crevices and gaps that need protection from high temperatures and EMI.
TIMs come in many different forms – including metal thermal interface material – to make sure the appropriate shape and material can be customized for each specific component. Parker Chomerics is a leader in high-quality, reliable TIMs. We have a proven track record of manufacturing TIMs that transfer heat from electronic components to heat sinks and eliminate air gaps from the interface.
The THERM-A-GAP™ GEL family provides single-component dispensable thermal gap fillers that require no curing and can be dispensed over a heat-generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes, and their cross-linked gel structure provides superior long-term thermal stability and performance.
Parker Chomerics THERM-A-GAP gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface. These materials deliver lower thermal impedance, higher thermal conductivity, and greater compliance and conformability to both microelectronics and large-scale electronics.
Deciding between the thermal interface material types of gap filler pads, also called thermal gap fillers, and dispensable compounds such as thermal putties and thermal gels can be challenging. Our experts break it down so you can understand which type of thermal interface material is best for your application.
With more than 60 years of experience, we have the technical know-how to meet the rapidly increasing needs of engineers.