Thermal Interface Material
Designed for ease of application with no curing requirements, our single component dispensable thermal gap filler gels can be integrated with robotic or automated dispensing equipment for high volume applications. This versatile product often eliminates the need for multiple gap pads on a device with a uniform height heat sink and various components that require cooling.
Thermal gap filler gels range in thermal conductivity and can provide secondary benefits such as stability in vertical or vibration applications or heat transfer at very thin bond lines. Their cross-linked gel structure provides superior long-term stability and performance.
Thermal Interface Material
THERM-A-GAP gap filler pads are a family of compressible, thermally conductive elastomers designed for applications where heat must be conducted between a semiconductor or battery and a heat-dissipating surface.
Gap filler pads come in a range of thicknesses and can typically be provided on various carrier substrates such as aluminum foil with a pressure sensitive adhesive (PSA), a woven fiberglass sheet, a PEN film, or a Kapton liner. They are available as full sheets or can be cut to specific sizes and shapes to meet application-specific needs.
High-quality thermal interface products from Parker Chomerics encompass a diverse range of materials to suit a variety of applications.
Every application is different, and that’s why we offer a broad range of gap filler solutions. If you need assistance identifying the most suitable gap filler for your application, speak with one of our expert engineers today.
Representing the highest thermal conductivity dispensable available from Parker Chomerics, THERM-A-GAP GEL 75 boasts 7.5 W/m-K thermal conductivity in a high-performance, one component, dispensable thermal interface material.
Part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials, this High Flow material is ideal for high-volume dispensing applications and high-throughput production operations.
With 5.0 W/m-K Bulk typical thermal conductivity, THERM-A-GAP GEL 50TBL is an optimal solution for thin bond line applications that improves on the performance limitations of traditional materials.
With the VT in its name indicating Vertical Tackiness, this product was developed to perform reliably in vertical and/or high-vibration applications and is our most reliable thermally conductive gel offering yet.
Deciding between the range of thermal gap filler pads and dispensable compounds such as thermal putties and thermal gels can be challenging, and there’s no one-size-fits-all solution. That’s because the specific requirements of each application will dictate which product is the best fit.
Our experts break it down so you can understand which type of thermal interface material is best for your application.
The highest-performing gap pad from Parker Chomerics, THERM-A-GAP PAD 80 has a thermal conductivity of 8.3 W/m-K, making it a great fit for applications where high temperatures are likely and performance can’t be sacrificed.
Once the thermal putty material in THERM-A-GAP PAD 70TP is compressed, it fills in gaps seamlessly and stays in place, translating to high-performance, low-compression force and superior thermal performance.
THERM-A-GAP PAD 60’s combination of high thermal conductivity and ultra-soft conformability, along with very low NASA outgassing, provides an effective thermal interface where uneven surfaces, air gaps, and rough surface textures may exist.
Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling devices, THERM-A-GAP PAD 30 provides the ideal combination of heat transfer, low outgassing, and low compressing forces.
Discover how to select a thermal gel or thermal pad with this on demand webinar. This on-demand webinar is all about thermally conductive dispensable gels and thermal gap filler pads, focusing on:
We’re pleased to introduce THERM-A-GAP™ PAD 80, the highest performing gap pad from Parker Chomerics. This pad has a thermal conductivity of 8.3 W/m-K, much higher than the 3-5 W/m-K range commonly seen in thermal pads these days. It is perfectly suited for applications where high temperatures are likely and performance can’t be scarified.
Two general types of thermal interface materials – gels (or dispensable gap fillers) and gap filler pads – are used by design engineers for displacing air voids and ensuring proper heat transfer. This white paper analyzes and draws conclusions about key performance and manufacturability characteristics in both gap pads and new advances in gels.
We’re proud to introduce THERM-A-GAP™ GEL 60HF. Part of the Parker Chomerics family of fully cured, silicone-based, dispensable thermal interface materials, this innovative gel is designed for high-performance heat transfer from electronics components to cooling features and flexible for use across industries and applications.
Two principal “gap filler” thermal interface materials prevalent on the market today are thermal gels – also known as dispensable gap fillers – and gap filler pads. So, which one should you select for your application? Here are the top 6 things you need to know.
Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.