Division Menu:
Featured THERM-A-GAP Gap Filler Pads
THERM-A-GAP PAD 80LO
Parker Chomerics THERM-A-GAP™ PAD 80LO is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K. PAD 80LO was developed to be a high reliability and long-term solution for mission critical and high-performance electronics in nearly every market segment including advanced computing, defense electronics, telecommunications infrastructure, and automotive modules.
“LO” in the product name stands for “Low Oil”, indicating the very low silicone oil bleed and migration properties of this gap pad. PAD 80LO is meant to be used where the aesthetic or manufacturing issues of silicone oils can be a concern.
THERM-A-GAP PAD 70TP
THERM‐A‐GAP PAD 70TP is a high performance, highly conformable thermally conductive gap filler pad with 7.0 W/m‐K thermal conductivity. It provides superior thermal performance and long‐term stability over conventional thermal pads with very low compression force.
THERM‐A‐GAP PAD 70TP is designed to provide effective heat transfer between electronic components and their associated cooling features such as heat sinks. The physical properties of this gap pad allow it to exhibit very high conformability and minimize the compressive load on underlying electronics.
THERM-A-GAP PAD 60
THERM-A-GAP™ PAD 60 is a high performance, thermally conductive gap filler pad with a thermal conductivity of 6.0 W/m-K. It provides excellent heat transfer and low compression forces while still maintaining conformability between mating surfaces.
THERM-A-GAP PAD 60 offers the combination of both excellent thermal conductivity and conformability, along with very low outgassing to provide an effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps and rough surface textures may exist.
THERM-A-GAP PAD 30
THERM-A-GAP™ PAD 30 is a thermally conductive, electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m‐K. Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling features, THERM‐A‐GAP PAD 30 offers the ideal combination of heat transfer, low outgassing, and low compressing forces.
With a Shore 00 hardness measurement of 30, it is designed to maintain conformability in gaps that contain uneven mating surfaces, air gaps, or where rough surface texture is a concern
THERM-A-GAP PAD
Thermal Interface Material
THERM-A-GAP gap filler pads are a family of low compression force, thermally conductive, silicone pads for applications where heat much be conducted away from electronics components such as batteries, CPUs, GPUs, and microprocessors.
Key features and benefits include:
- Standard sheet stock or precut offerings
- Available in sheets for easy secondary manufacturing
- Can be provide in precision cut shapes and sizes
- High reliability
- Shows no performance degradation after long-term aging, thermal cycling, and vibration testing
- Ease of assembly
- Simple "pick and place" application process
- Multiple carrier options
- Fiberglass carrier for ease of handling
- Aluminum foil carrier with pressure sensitive adhesive (PSA)
- PEN film carrier for shear resistance
- Kapton carrier for shear resistance and improved thermal performance
- Low compression force
- Applies minimal stress, making it effective for fragile electronics
- High surface tack
- Designed for a wide range of gaps
Need Help Finding the Right Gap Filler? Talk to an Expert Engineer Now.
If you need assistance identifying the most suitable gap filler for your application, speak with one of our expert engineers. Our team is ready to help.
Performance Characteristics
Low Compressions Force
Gap filler pads require slight deflection in order to make effective thermal contact between heat-generating and heat-dissipating surfaces, usually a minimum of about 5% of the nominal pad thickness. They are also a low compression force material, meaning that they require very low forces to reach ideal deflection levels and do not impart force on underlying, fragile components.
Gap Pad Application
Gap pads are ideal solutions for simple assembly applications. They can be provided on kiss-cut sheets or packaged based on assembly requirements. Using a "pick and place" process, gap pads can be applied manually or using an automated robot.
Thermal Conductivity
Thermal conductivity of a material, typically measured in Watt per meter Kelvin (W/m-K) is a bulk material property that represents its ability to transfer heat. A higher thermal conductivity is associated with greater heat dissipation.
The thermal conductivity of gap filler pads ranges from 1 to 8 W/m-K depending on the material formulation and is continuing to increase with new material developments.
Long-Term Reliability
Thermal gap pads have been around for decades and were developed for low power electronics that needed basic cooling as well as high performance, critical applications. Rigorous accelerated aging tests are performed on all materials, especially newly launched products, to help ensure long-term reliability.
Parker Chomerics conducts standard, long-term reliability testing that includes compression vs deflection testing and thermal impedance measurements before and after high heat or humidity exposure. Testing for outgassing is also conducted to ensure that silicone and non-silicone gap pads are able to meet the low outgassing requirements put in place by NASA (ASTM E595 testing).
Vibration testing is also performed based on teh GMW3172 automotive test standard. Industry specific testing is available upon request to verify the effective performance of thermal gap pads in customer-specific applications.
Design Flexibility and Ease of Use
Thermal gap pads are preferred thermal interface material option for many product designers and engineers because of the associated design flexibility and ease of use. For prototyping, gap pads can be purchased in standard or custom thicknesses in bulk sheets or rolls. They can then easily be cut to shape. Once designed into product volumes, they can be provided as custom kiss-cut parts or kitted for ease of assembly.
Should I Use a Gap Pad or Gel?
Deciding between the thermal interface material types of gap filler pads, also called thermal gap fillers, and dispensable compounds such as thermal putties and thermal gels can be challenging. Our experts break it down so you can understand which type of thermal interface material is best for your application.
Need a THERM-A-GAP GEL Instead of a PAD?
If you need assistance identifying the most suitable gap filler for your application, speak with one of our expert engineers. Our team is ready to help.
Thermal Interface Materials
We offer an extensive range of thermal interface materials, including thermally conductive adhesive tapes, thermally conductive greases, thermally conductive heat spreaders, and thermally conductive phase change materials. We invite you to explore our selection and determine which materials are best suited for your specific application. Our products are designed with reliability and quality in mind, and our commitment to customer satisfaction is paramount.
Blog | Quality & Innovation
THERM-A-GAP PAD 80: Performance and Elastomeric Benefits in One Thermally Conductive Gap Filler Pad
We’re pleased to introduce THERM-A-GAP™ PAD 80, the highest performing gap pad from Parker Chomerics. This pad has a thermal conductivity of 8.3 W/m-K, much higher than the 3-5 W/m-K range commonly seen in thermal pads these days. It is perfectly suited for applications where high temperatures are likely and performance can’t be scarified.
Thermal Interface Materials: Choosing Between Gels and Gap Filler Pads
Two general types of thermal interface materials – gels (or dispensable gap fillers) and gap filler pads – are used by design engineers for displacing air voids and ensuring proper heat transfer. This white paper analyzes and draws conclusions about key performance and manufacturability characteristics in both gap pads and new advances in gels.
.jpg)
Protect Equipment with a High-Performing Gap Filler Pad
New from Parker Chomerics is the THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pad. This ultra-soft, ultra-conformable, high-performance product provides a very low hardness (15 Shore 00) solution with 7.0W/m-K thermal conductivity. THERM‐A‐GAP PAD 70TP is designed to provide effective heat transfer between electronic components and their associated cooling features such as heat sinks.
Thermal Gels or Gap Filler Pads? Top 6 Things You Should Know.
Two principal “gap filler” thermal interface materials prevalent on the market today are thermal gels – also known as dispensable gap fillers – and gap filler pads. So, which one should you select for your application? Here are the top 6 things you need to know.
Webinar: Selecting a Thermal Gel or Thermal Gap Pad
Discover how to select a thermal gel or thermal pad with this on demand webinar. This on-demand webinar is all about thermally conductive dispensable gels and thermal gap filler pads, focusing on:
- How to determine which thermal interface material is right for you
- The benefits of each - a dispensable gel or gap pad and what you need to know about them
- Determining your requirements and selecting a material that best suits your application
Empowering Your Business on a Global Scale
Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.
