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Featured THERM-A-GAP Gap Filler Gels
THERM-A-GAP GEL 75
THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.
THERM-A-GAP GEL 60HF
THERM-A-GAP GEL 60HF is a one component, silicone-based, dispensable thermal interface material with a 6.2 W/m-K thermal conductivity. The “HF” in GEL 60HF stands for “High Flow”, indicating that the material is ideal for high volume dispensing applications and high throughput production operations.
THERM-A-GAP GEL 50VT
THERM-A-GAP™ GEL 50VT is a reworkable, high performance, one-component silicone, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity. The “VT” suffix in the product name stands for “Vertical Tackiness.”
THERM-A-GAP GEL 50TBL
Parker Chomerics THERM-A-GAP GEL 50TBL is a reworkable, high performance, one component, dispensable, thermal interface material with 5.0 W/m-K Bulk typical Thermal Conductivity. The “TBL” suffix stands for Thin Bond Line, indicating that this material is meant for thin bond line applications.
THERM-A-GAP GEL
“Gels” – the dispensable gap fillers that are highly conformable, pre-cured, single-component compounds – feature a cross-linked gel structure that provides long-term thermal stability and reliability.
Key features and benefits include:
- One-component, dispensable
- Eliminates multiple part numbers
- Aids in automation
- Fully cured
- Requires no refrigeration
- No mixing or additional curing
- No settling in storage
- Long-term reliability
- Will not harden
- Will not become brittle or crack
- Highly conformable at low pressure
- Applies minimal stress, making it effective for delicate components
- High surface tack
- Easily reworkable
- Designed for a wide range of gaps
Need Help Finding the Right Gap Filler? Talk to an Expert Engineer Now.
If you need assistance identifying the most suitable gap filler for your application, speak with one of our expert engineers. Our team is ready to help.
Performance Characteristics
Conformability
Gels are highly conformable and are meant to be deflected between surfaces after being applied. They are electrically insulating and therefore pose no risk of conductive FOD on PCBs.
Flow rate
The goal when developing gels is to achieve the highest and most repeatable flow rate. Customers want to be able to set their dispensing equipment for the same flow rate batch-to-batch to maintain a consistent volume of material and avoid waste. Newer gel technologies achieve a more repeatable and higher flow rate that improves throughput and reduces waste.
Thermal conductivity
Thermal conductivity of a material, typically measured in Watt per meter Kelvin (W/m-K) is a bulk material property that represents its ability to transfer heat. A higher thermal conductivity is associated with greater heat dissipation.
The thermal conductivity of gap filler gels ranges from 1 to 10 W/m-K depending on material formualtion and is continuing to increase with new material developments.
NOTE: Thermal impedance is a measure of heat transfer characteristics that takes into account resistance to heat transfer at junctions between materials. Thermal gels, because of their ability to "wet out" and minimize contact resistance, may outperform other types of thermal interface material with equivalent thermal conductivity.
Long-term reliability
Thermal gels have been around for nearly two decades and were developed to perform for long periods of time in critical and high performance applications. Rigorous accelerated aging tests are performed on all materials, especially newly launched products, to help assure long-term reliability.
Parker Chomerics conducts standard, long-term reliability testing that includes testing thermal impedance before and after heat aging, temperature cycling, and combined heat/humidity exposure. Long term heat aging testing consists of 1000 hours of material exposure to 125°C. Temperature cycling involves cycling the material 1000 times from -40°C to 125°C with a 10°C per minute ramp and a 15 minute dwell time at high and low temperatures. Combined heat and humidity testing involved exposing a sample of material to 85°C and 85% relative humidity for 1000 hours.
Vibration testing is also performed based on the GMW3172 automotive test standard. Industry specific testing is available upon request to verify the effective performance of thermal gels in customer-specific applications.
Fully Cured
Curing refers to the irreversible chemical reaction that joins or cross-links polymer chains within a material, in this case a thermal interface material. Thermal gels are fully cured when supplied and require no secondary cure when dispensed or applied into an application. This is different from other types of thermal interface material that require the material to undergo a cure process, typically several hours or days at room temperature or a shorter period of time when exposed to higher temperatures. This gives gels the added benefit of not delaying, or adding complexity to, the manufacturing process. Simply dispense the gel, apply the mating surfaces together, and the material will immediate provide heat transfer characteristics.
Curing contributes to the viscoelastic properties of gels which improves form stability over a non-cured system. Additionally, fully cured and cross-linked materials are resistant to breakdown from solvents and harsh chemicals.
THERM-A-GAP GEL Suffixes
- HF - High Flow, indicating that the material is ideal for high volume dispensing applications and high throughput production operations.
- NS - Non-Silicone, ideal for applications where silicone contamination is an issue, such as optical systems or where silicone use is restricted
- TBL - Thin Bond Line, indicating that this material is meant for thin bond line applications
- VT - Vertical Tackiness, indicating that this material is meant to perform reliably in vertical and/or high vibration applications
Should I Use a Gap Filler Pad or Gel?
Deciding between the thermal interface material types of gap filler pads, also called thermal gap fillers, and dispensable compounds such as thermal putties and thermal gels can be challenging. Our experts break it down so you can understand which type of thermal interface material is best for your application.
Need a THERM-A-GAP PAD Instead of a GEL?
If you need assistance identifying the most suitable gap filler for your application, speak with one of our expert engineers. Our team is ready to help.
Thermal Interface Materials
We offer an extensive range of thermal interface materials, including thermally conductive adhesive tapes, thermally conductive greases, thermally conductive heat spreaders, and thermally conductive phase change materials. We invite you to explore our selection and determine which materials are best suited for your specific application. Our products are designed with reliability and quality in mind, and our commitment to customer satisfaction is paramount.
Blog | Quality & Innovation
When Reliability Matters Most, Trust THERM-A-GAP GEL 50VT
THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.
THERM-A-GAP GEL 50TBL: The Next Generation of Thin Bond Line Thermal Interface Materials
Miniaturization. Higher Power. Higher Component Density. These are the trademarks of many modern electronic devices. While these trends are helping push the boundaries of what devices can do, they come with their fair share of challenges. THERM-A-GAP GEL 50TBL (TBL = Thin Bond Line) is the Parker Chomerics solution to thin bond line applications and an alternative to current greases and phase change materials (PCMs).
Non-Silicone Dispensable Thermal Interface Material for SSD Modules
As storage capacities increase and costs decrease, SSD device manufacturing will continue to grow, some estimating as much as a 15% CAGR through 2030. This increase in SSD devices is across most sub-categories of solid-state drives including SATA and M.2 as well as higher performance variations like PCIe/NVMe.
Improve Assembly Efficiency with THERM-A-GAP GEL 60HF
We’re proud to introduce THERM-A-GAP™ GEL 60HF. Part of the Parker Chomerics family of fully cured, silicone-based, dispensable thermal interface materials, this innovative gel is designed for high-performance heat transfer from electronics components to cooling features and flexible for use across industries and applications.
Webinar: Selecting a Thermal Gel or Thermal Gap Pad
Discover how to select a thermal gel or thermal pad with this on demand webinar. This on-demand webinar is all about thermally conductive dispensable gels and thermal gap filler pads, focusing on:
- How to determine which thermal interface material is right for you
- The benefits of each - a dispensable gel or gap pad and what you need to know about them
- Determining your requirements and selecting a material that best suits your application
Empowering Your Business on a Global Scale
Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.
