THERM-A-GAP GELs are single component dispensable thermal gap fillers that require no curing and can be dispensed over a heat-generating component for effective cooling, providing superior long-term thermal stability while eliminating the need to use multiple thermal gap filler pad part sizes.
Designed to be soft and reduce component stress, THERM-A-GAP gap filler pads are a family of thermally conductive silicone and non-silicone elastomers that are ideal for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
Gap fillers are an important component in thermal management for electronic devices, helping to improve heat transfer and prevent overheating that can damage components and affect performance. Available in dispensable gel or pad form, gap fillers are designed to enhance thermal performance and enable easy application for high-volume manufacturing operations.
Gap fillers work by filling in air gaps with a thermally conductive material, preventing the air from acting as an insulator around heat-generating components. The gaps filled by these materials can range from microscopic, typically as small as 0.001" or 0.25mm, and as large as 0.400", or 10mm and greater. They can be dispensed or applied onto specific components or cover multiple surfaces.
Deciding which TIM to use can be challenging, and it’s important to remember that the best choice is the one that fits your application’s specific requirements.
If you need assistance identifying the most suitable gap filler for your application, our team of expert engineers is standing by to help.
A high-performance, one component dispensable gel, THERM-A-GAP GEL 75 represents the highest thermal conductivity dispensable available from Parker Chomerics. With a flow rate of 30 grams per second, it is nearly 3x faster than the next closest-performing material in the THERM-A-GAP family.
THERM-A-GAP GEL 50TBL is a 5.0 W/m-K, fully cured, one component, thermal gel that provides an optimal solution for thin bond line applications and an improvement to the performance limitations of traditional materials such as greases and phase change materials.
THERM-A-GAP PAD 80, the highest performing gap pad from Parker Chomerics, has a thermal conductivity of 8.3 W/m-K and is perfectly suited for applications where high temperatures are likely and performance can’t be sacrificed.
Providing superior thermal performance, THERM-A-GAP PAD 70TP is an ultra-soft, ultra-conformable product that combines a very low hardness (15 Shore 00) solution with 7.0W/m-K thermal conductivity.
In addition to gap fillers, we offer an extensive range of thermal interface materials, including thermally conductive adhesive tapes, thermally conductive greases, thermally conductive heat spreaders, and thermally conductive phase change materials. We invite you to explore our selection of reliable, high-quality solutions to determine which materials are best suited for your specific application.
THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.
Miniaturization. Higher Power. Higher Component Density. These are the trademarks of many modern electronic devices. While these trends are helping push the boundaries of what devices can do, they come with their fair share of challenges. THERM-A-GAP GEL 50TBL (TBL = Thin Bond Line) is the Parker Chomerics solution to thin bond line applications and an alternative to current greases and phase change materials (PCMs).
We’re pleased to introduce THERM-A-GAP™ PAD 80, the highest performing gap pad from Parker Chomerics. This pad has a thermal conductivity of 8.3 W/m-K, much higher than the 3-5 W/m-K range commonly seen in thermal pads these days. It is perfectly suited for applications where high temperatures are likely and performance can’t be scarified.
Two general types of thermal interface materials – gels (or dispensable gap fillers) and gap filler pads – are used by design engineers for displacing air voids and ensuring proper heat transfer. This white paper analyzes and draws conclusions about key performance and manufacturability characteristics in both gap pads and new advances in gels.
A leading engineering and manufacturing company, Parker Chomerics has decades of industry-specific expertise to match the right thermal interface material and electromagnetic shielding solution with each application, providing unmatched engineering support every step of the way.
Our manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.