Thermal Management - Chomerics Division | Parker US
Thermal Interface Materials & Thermal Gap Fillers

Parker Chomerics

Thermal interface materials from Parker Chomerics improve device performance by transferring heat from electronic components to heat sinks and eliminating air gaps from the interface. Our THERM-A-GAP® line of thermal gap fillers delivers lower thermal impedance, higher thermal conductivity, and greater compliance and conformability to both microelectronics and large scale electronics. 

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THERM-A-GAP PAD 80LO

The Next Generation of Thermal Gap Filler Pad

By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3 W/m-K, PAD 80LO is designed for high heat-output components. “LO” in the product name stands for “Low Oil” and indicates measurably less silicone oil bleed compared to leading competitors.

8.0 W/m-K High Performance, Low Oil Bleed, Low Relaxation Force Thermal Gap Filler Pad

Advanced Battery Energy Storage Systems (BESS) Solutions: THERM-A-GAP CIP 60

Battery energy storage systems generate large amounts of heat, and they need high-performing thermal solutions to help them perform safely and optimally. THERM-A-GAP CIP 60 was designed for this high-stakes scenario.

Advanced Battery Energy Storage Systems (BESS) Solutions: THERM-A-FORM CIP 60

When Reliability Matters Most, Trust THERM-A-GAP™ GEL 50VT

THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.

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THERM-A-GAP GEL 50TBL: The Next Generation of Thin Bond Line Thermal Interface Materials

Miniaturization. Higher Power. Higher Component Density. These are the trademarks of many modern electronic devices. While these trends are helping push the boundaries of what devices can do, they come with their fair share of challenges. THERM-A-GAP GEL 50TBL (TBL = Thin Bond Line) is the Parker Chomerics solution to thin bond line applications and an alternative to current greases and phase change materials (PCMs).

Thin Bond Line Thermal Interface Material

Thermal Gels or Gap Filler Pads? Top 6 Things You Should Know.

Two principal “gap filler” thermal interface materials prevalent on the market today are thermal gels – also known as dispensable gap fillers – and gap filler pads. So, which one should you select for your application? Here are the top 6 things you need to know.

Thermal interface materials green pads and pink gels

Thermal Gap Fillers

A type of thermal interface material known as a "gap filler" is specifically designed to fill large gaps between heat-generating and heat-dissipating surfaces. Gap filler materials can be selectively placed or used to cover multiple heat sources within a single application, and can be used at varying heights to displace air and provide effective cooling.

Our products are used in a wide range of industries.


 

Parker Chomerics Industries

Empowering Your Business on a Global Scale

Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements. 

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