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Thermally Conductive Gels
Discover which Parker Chomerics THERM-A-GAP GEL is best for your application. These single component dispensable thermal gap fillers require no curing and can be dispensed over a heat generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance.
Thermally Conductive Pads
Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
Thermally Conductive Potting and Encapsulation
Parker Chomerics THERM-A-FORM™ thermally conductive compounds are two-component materials that require a cure and are used on complex geometries for cooling of multiple height heat generating components without the expense of molded sheets or gap pads.
Thermally Conductive Electrical Insulator Pads
Parker Chomerics CHO-THERM Thermally Conductive Electrical Insulator Pads are designed for use where the highest possible thermal, dielectric, and mechanical properties are required.
Thermally Conductive Phase Change Materials
Parker Chomerics THERMFLOW® phase-change Thermal Interface Materials (TIMs) effectively eliminate interfacial air gaps and voids. They also remove trapped air between electronic components that generate heat. These phase-change materials are engineered to optimize heat sink efficiency and enhance the reliability of components.
Thermally Conductive Greases
Our thermally conductive greases are silicone-based, single component materials which conduct heat between a hot component and a heatsink or enclosure.
Thermally Conductive Adhesive Tapes
Parker Chomerics THERMATTACH® tapes are formulated with acrylic or silicone based pressure sensitive adhesive (PSA) loaded with thermally conductive fillers. They are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism.
Thermally Conductive Heat Spreaders
The Parker Chomerics range of thin heat spreaders offers a cost-effective solution for cooling IC devices in confined spaces where traditional heat sinks are unsuitable.
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THERM-A-GAP PAD 80LO
The Next Generation of Thermal Gap Filler Pad
By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3 W/m-K, PAD 80LO is designed for high heat-output components. “LO” in the product name stands for “Low Oil” and indicates measurably less silicone oil bleed compared to leading competitors.
Advanced Battery Energy Storage Systems (BESS) Solutions: THERM-A-GAP CIP 60
Battery energy storage systems generate large amounts of heat, and they need high-performing thermal solutions to help them perform safely and optimally. THERM-A-GAP CIP 60 was designed for this high-stakes scenario.
When Reliability Matters Most, Trust THERM-A-GAP™ GEL 50VT
THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.
THERM-A-GAP GEL 50TBL: The Next Generation of Thin Bond Line Thermal Interface Materials
Miniaturization. Higher Power. Higher Component Density. These are the trademarks of many modern electronic devices. While these trends are helping push the boundaries of what devices can do, they come with their fair share of challenges. THERM-A-GAP GEL 50TBL (TBL = Thin Bond Line) is the Parker Chomerics solution to thin bond line applications and an alternative to current greases and phase change materials (PCMs).
Thermal Gels or Gap Filler Pads? Top 6 Things You Should Know.
Two principal “gap filler” thermal interface materials prevalent on the market today are thermal gels – also known as dispensable gap fillers – and gap filler pads. So, which one should you select for your application? Here are the top 6 things you need to know.
Thermal Gap Fillers
A type of thermal interface material known as a "gap filler" is specifically designed to fill large gaps between heat-generating and heat-dissipating surfaces. Gap filler materials can be selectively placed or used to cover multiple heat sources within a single application, and can be used at varying heights to displace air and provide effective cooling.
Blog | Quality & Innovation
Solving EV Charging Station Design Challenges: Thermal Interface Materials and EMI Shielding Solutions
Improve Assembly Efficiency with THERM-A-GAP GEL 60HF
Why Do TIMs Break Down at High Voltages?
THERM‐A‐GAP PAD 70TP: Protect Equipment with a High-Performing Gap Filler Pad
Integrated Assembly Required for Automotive Instrument Gauge Cluster
Non-Silicone Dispensable Thermal Gel for Automotive Infotainment and Camera Modules
Automotive Component Manufacturer Requires Heat Dissipation for EV/Hybrid Vehicle DC/DC Converter
High Performing Thermal Interface Material Required for Automotive Safety Module Manufacturer
5G mmWave Base Station Thermal Management
THERM-A-GAP PAD 60: High Performance Thermal Gap Pad for Smart Home Device
Resources
Webinar: Dispensing For Beginners: Thermal Interface Materials
Whitepaper: Thermal Interface Materials: Choosing Between Gels and Gap Filler Pads
Thermal Interface Materials for Electronics Cooling
Webinar: EMI Shielding, Grounding, and Thermal Management for Connectors and Cable Assemblies
Webinar: 2022 Thermal Interface Material Innovations for Consumer Electronics
Webinar: Application of EMI Shielding, Conductive Plastics and Thermal Management Materials for ADAS Radar Sensor Modules
Webinar: EMI Shielding and Thermal Interface Solutions for Space Applications
Webinar: Selecting a Thermal Gel or Thermal Gap Pad
Glossary of Common Thermal Interface Material Terms
Empowering Your Business on a Global Scale
Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.
