Webinar: 2024 Thermal Interface Material Innovations

Parker Chomerics Headquarters in Woburn, MA

2024 Thermal Interface Material Innovations

Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications. These novel products continue to expand the portfolio of high performance, high reliability thermal gap pads and dispensable thermal gels.

The Telecommunications, Energy Storage, Automotive, Defense, Aerospace, Consumer Electronics, and Industrial markets are pushing the boundaries of heat management within high-power electronics components such as single chips, multi- chip modules, integrated circuits, etc. and looking to thermal interface materials to ensure long product life and consistent performance.

Parker Chomerics is a global leader in the development and manufacture of thermal interface materials (TIMs) for electronics thermal management. Over the last year, we have developed several new materials that we are eager to share. In this webinar, you will learn about our new dispensable thermal gels, hear about our product validation and qualification processes, and get a sneak peak into our product roadmap with details on materials to be launched later this year.

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Learn about our new dispensable thermal gels

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THERM-A-GAP GEL 35VT

THERM-A-GAP GEL 35VT is a reworkable, one-component silicone, dispensable thermal interface gel material with 3.5 W/m-K typical thermal conductivity. The “VT” suffix in the product name stands for Vertical Tackiness.

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THERM-A-GAP GEL 50VT

THERM-A-GAP™ GEL 50VT is a reworkable, high performance, one-component silicone, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity. The “VT” suffix in the product name stands for “Vertical Tackiness.”

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THERM-A-GAP GEL 50TBL

THERM-A-GAP GEL 50TBL is a reworkable, high performance, one component, dispensable, thermal interface material with 5.0 W/m-K Bulk typical Thermal Conductivity. The “TBL” suffix stands for Thin Bond Line, indicating that this material is meant for thin bond line applications.

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THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.

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Blog | Quality & Innovation

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THERM-A-GAP GEL 50TBL: The Next Generation of Thin Bond Line Thermal Interface Materials

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Non-Silicone Dispensable Thermal Interface Material for SSD Modules

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Parker Chomerics Industries

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