2023 Thermal Interface Material Innovations - Chomerics Division | Parker US
Parker Chomerics Headquarters in Woburn, MA

Webinar

Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications. These novel products continue to expand the portfolio of high performance, high reliability thermal gap pads and dispensable thermal gels.

The Telecommunications, Energy Storage, Automotive, Defense, Aerospace, Consumer Electronics, and Industrial markets are pushing the boundaries of heat management within high-power electronics components such as single chips, multi- chip modules, integrated circuits, etc. and looking to thermal interface materials to ensure long product life and consistent performance. 

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In This Webinar, You Will Learn About:

  • non-silicone thermal gels
  • high thermal conductivity gap pads
  • high flow rate, one component thermal gels
  • very low hardness thermal putty gap pads
  • how all these products can help solve design and engineering issues

 You will hear about real-world applications where these materials are being used and the best practices for utilizing them in your systems.

Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications.

Mentioned in This Webinar

Discover a diverse range of solutions, including one component thermal gels, thermal pads, and more, designed to provide effective thermal interface protection. Don't miss out on this opportunity to unlock the potential of these innovative products and their applications across many industries.

Thin Bond Line Thermal Interface Material

Our Newest High Performance, Non-Silicone Thermal Gel

Parker Chomerics THERM-A-GAP™ GEL 40NS is a high-performance, one component, urethane based, dispensable thermal interface gel material with 4.0 W/m-K thermal conductivity, developed to conduct heat from electronics to a heat sink or enclosure.

gray thermal interface material gel in syringe

When Reliability Matters Most, Trust THERM-A-GAP™ GEL 50VT

THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.

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Need Help Finding the right thermal material? Talk to an Expert Engineer Now.

If you need assistance identifying the most suitable product for your application,  speak with one of our expert engineers. Our team is ready to help.

Our products are used in a wide range of industries.

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