Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications. These novel products continue to expand the portfolio of high performance, high reliability thermal gap pads and dispensable thermal gels.
The Telecommunications, Energy Storage, Automotive, Defense, Aerospace, Consumer Electronics, and Industrial markets are pushing the boundaries of heat management within high-power electronics components such as single chips, multi- chip modules, integrated circuits, etc. and looking to thermal interface materials to ensure long product life and consistent performance.
