All drone equipment must comply to electromagnetic compatibility or EMC regulations when the product is released to the market. These regulations ensure the safe, secure, and sustainable use of drones.
As well as compliance, the drone’s electronic system was not working to its full potential and connection to the drone was inconsistent, prompting safety issues.
Electromagnetic inference (EMI) within the drone’s electronic housing was causing system failure due to its operation near or around cell phone towers, buildings, antennae, high-voltage power lines and other obstacles. Communication from ground systems were causing serious electromagnetic interference, affecting the drone’s performance.
The drone’s electronics were also producing excess heat as a result of the high processing power and strong rotors, so our customer was searching for a thermal management solution that would help to improve reliability and prevent premature failure.
Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity. Learn More.
Tell us a little bit about your problem and we'll do our best to come up with a cost effective, timely quote to help you get started.
The drone manufacturer’s design team and Parker Chomerics application engineers devised a solution that would help the drone pass testing methods for EMI/EMC susceptibility.
The design team needed to reduce EMF radiation levels as well as mitigate sources of external disturbances to harden the design.
A robotically dispensed form-in-place (FIP) EMI gasket called CHO-FORM® 5575 was directly dispensed onto the aluminum casting of the drone as a barrier to prevent the different electrical circuits from talking to each other and to prevent electronic failure of the drone. CHO-FORM 5575 is a moisture cured silver-plated aluminum filled silicone offering up to 80 dB shielding effectiveness.
Using an FIP gasket saved 50% of space and weight in the housing as flanges can be as narrow as 0.025 in (0.76mm).
CHO-FORM 5575 has a high resistance to corrosion when dispensed onto aluminum, so was selected to prevent galvanic corrosion in the electronic enclosure.
Parker Chomerics CHOFORM 5575 form-in-place EMI gasket is a moisture cure silicone system with 80 dB shielding effectiveness ideal for corrosion resistance in high temperature applications. Learn more.
THERM-A-GAP™ GEL 37 (3.7 W/m-K thermal conductivity) was used to conduct the heat from the chipset to the enclosure. This pre-cured, single component thermal gel material was dispensed directly onto the chipset by automation, significantly reducing production time. GEL 37 has a soft, paste consistency which eliminates any stress on the electronic components and requires no mixing or curing.
Adding the EMI shielding and thermal solution to the device by automation improved productivity and reduced time to market.
Parker Chomerics global operations can offer local manufacturing in line with customer requirements, as well as provide application engineering and supply chain support.
Our total assembly service can supply the metal castings, add EMI and thermal management solutions to the electronic housing or PCB, and supply as one complete unit. To learn more please contact us at parker.com/chomerics.
Parker Chomerics THERM-A-GAP™ GEL 37 is a single-component, fully cured, dispensable thermal gel with 3.7 W/m-K Thermal Conductivity, designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations. Learn more.
Tell us a little bit about your problem and we'll do our best to come up with a cost effective, timely quote to help you get started.
If you need assistance identifying the most suitable product for your application, speak with one of our expert engineers. Our team is ready to help.
As the defense industry continues to push the boundaries on advanced electronic systems and state-of-the-art communication devices, the requirements governing these programs must follow suit. Among the many technical requirements is Electromagnetic Compatibility, defined as the ability of a device to withstand both anticipated and unanticipated electronic interference (EMI) as well as minimize the interference being radiated.
Parker Chomerics thermal interface materials transfer heat from electronic components to heat sinks and are used to eliminate air gaps from the interface. Our THERM-A-GAP® materials deliver lower thermal impedance, higher thermal conductivity and greater compliance and conformability to both microelectronics and large scale electronics.
With more than 60 years of experience, we have the technical know-how to meet the rapidly increasing needs of engineers.