How 3D Printed EMI Shielding Vents Solve Overheating and Electromagnetic Interference in Electronics - Chomerics Division | Parker US
How to Ground Electronics

When designing complex electronic assemblies, engineers must address two critical issues: preventing device overheating and minimizing electromagnetic interference (EMI). Traditionally, vents made from aluminum, brass, or steel honeycomb are used to manage heat, but they can create EMI problems.

Additive Manufacturing (AM) offers a solution by producing homogeneous EMI vents that improve performance, eliminate foreign object debris risks, and provide greater design flexibility. Parker Chomerics' preliminary tests show that AM vents offer better shielding effectiveness and airflow compared to traditional methods, indicating a promising future for AM in meeting stringent industry requirements.

Addressing Overheating and Electromagnetic Interference in Complex Electronic Assemblies

When designing complex electronic assemblies, engineers must proactively consider two common issues: avoiding overheating of the device itself, and preventing the device from emitting electromagnetic interference that may negatively impact other nearby electronic devices. 

The Challenge of Device Overheating

Electronic devices generate heat during operation, which can decrease their efficiency and lifespan if not properly managed. Ventilation openings are frequently used for the dissipation of heat, either by flowing cooling air into the enclosure or providing an exhaust outlet for hot air. However, despite their crucial role in preventing device overheating, these openings introduce another challenge by providing a pathway for electromagnetic waves to be emitted from the enclosed electronic assembly. These waves can impact the function of nearby devices, or conversely, nearby electronics’ electromagnetic radiation can impact the operation of the enclosed device. This is known as electromagnetic interference, or EMI. 

Traditional Manufacturing Limitations

The objective of EMI air vents is to maintain air flow through the enclosure while blocking electromagnetic waves, ultimately preventing disruptions in device function. Engineers typically look to maximize air flow while meeting the shielding effectiveness specifications. As technology advancements drive more stringent technical specifications, engineers seek increased design freedom without compromising any performance requirements of standard EMI vents. Parker Chomerics strives to deliver technologies that exceed performance design criteria and simultaneously capitalize on opportunities to simplify our manufacturing processes and ensure the highest performance quality of our products.

Currently, EMI vents are manufactured from sheets of aluminum, brass, or steel honeycomb (thin ribbons selectively bonded together) and assembled into a stamped or extruded metal frame. However, shielding gaps remain at bond locations and at the interface between the frame and honeycomb, typically requiring several post-processing steps to satisfy shielding requirements.

In use, EMI vents are installed via bolts that are screwed through bushings inserted into the frame. This can cause pieces of metal from the honeycomb to become encapsulated inside the hollow frame. These metal pieces are considered Foreign Object Debris (FOD), which is not allowed in highly regulated market segments such as aircraft and military applications.

Honeycomb is manufactured in flat sheets, and this significantly limits the design freedom of electronics enclosures. Not only is a flat mounting area on the enclosure needed to attach an EMI vent, but only basic shapes can be consistently cut out of honeycomb sheets. As electronics assemblies become more compact and enclosure designs become more complex, there is increased need for flexibility in vent designs. Furthermore, since honeycomb is manufactured to standard cell sizes and sheet thicknesses, there is little opportunity for optimization between air flow and shielding effectiveness.

3D Printing Additive Manufacturing (AM) Solution

Through a novel method of manufacturing EMI vents using Additive Manufacturing (AM), we can address all these challenges by creating a single homogeneous part. By removing secondary operations, increasing vent performance, eliminating FOD risk, and facilitating design freedom, we can deliver a superior product with a shorter lead time.

Parker Chomerics is exploring manufacturing of vents through Additive Manufacturing and completed a preliminary performance comparison to traditionally manufactured vents. The vents were designed using a honeycomb cell size of 1/8” and thickness of 0.5”, with outer dimensions of 5” x 7”, which is representative of many parts that Parker Chomerics manufactures. Benchmark vents were manufactured from aluminum with electroless nickel plating and brass with tin-lead plating.

Our comparison between traditional and AM vents is focused on shielding effectiveness and air flow data, specifically between traditionally manufactured and Additively Manufactured aluminum vents, as well as between traditionally manufactured brass vents and Additively Manufactured Inconel vents.

Shielding effectiveness data was collected using the ASTM D4935 Standard over a frequency range of 800 MHz to 50 GHz (Figure 1a, b). Data was primarily analyzed in the “horizontal” orientations, which is the best-case shielding orientation. It was evident from the data that for both Inconel and Aluminum, vents maintained a high shielding effectiveness through 24 GHz. This is a significantly higher frequency than traditionally manufactured Brass and Aluminum vents, which drop off around 4 GHz (Figure 2a). It is also worth noting that, as hypothesized, shielding effectiveness of the AM vents behaved consistently regardless of directionality, whereas the traditional vents’ shielding effectiveness in the “vertical” orientation (worst case) dropped off around 2 GHz.

Air flow was also tested using a tabletop air flow tunnel (Figure 1c, d). AM vents performed better than traditionally manufactured vents, as indicated by a lower pressure drop across the vent for all wind speeds tested (Figure 2b). It is unclear how air flow may be affected at higher wind speeds, but with our ability to customize the cell sizes based on the required signal attenuation, we anticipate that cell sizes will be able to increase and air flow can be maximized.

3D Printed EMI Shielding Vents
3D Printed EMI Shielding Vents EMC Testing

Test setup for EMI shielding (A, B) and air flow (C, D)

3D Printed Vents EMC Testing Shielding Effectiveness

An additional physical characteristic that will be relevant to the performance of the air vents is the weight, especially for enclosures on applications such as airplanes and helicopters. All 3D printed Inconel samples were significantly lighter than our benchmark brass vent, with the top performing Inconel vents ranging between 57.9% and 72.3% of the total weight of the brass benchmark. Aluminum AM vents were somewhat heavier than benchmark aluminum, weighing in approximately 16.5% heavier (Figure 2c). The AM parts were not fully optimized for SLS printing, and we believe that with further Design for Additive Manufacturing (DfAM) we can see even more reduction in weight.

This exploration into additively manufactured EMI vents lays the groundwork for the wide adoption of this processing capability in industries with stringent performance requirements. It is evident from the shielding and air flow testing that direct swapping of traditionally manufactured vents with AM vents leads to stronger functional performance. Combined with the reduction of FOD and weight, engineers who utilize EMI vents will experience significantly better product outcomes via AM. Additionally, they will have significantly greater opportunities for design iteration due to the reduced lead time.

Furthermore, AM opens significant design freedom for engineers. Since we no longer need to worry about those standard material sizes with Additive Manufacturing, we can better attenuate the cells to the precise shielding performance required. For example, in some cases we are able to utilize larger cells and increase air flow. We can also better serve our customers in designing custom sizes and shapes of vents to their enclosures, including non-flat parts and larger vent assemblies that require honeycomb in multiple areas.

Advancing EMI Vent Design with 3D Printing

By manufacturing EMI vents with AM, we can better serve our customers with greater design flexibility and increased product performance, and we’re excited to continue refining this innovation.

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Discover the power of advanced 3D-printed EMI shielding vents from Parker Chomerics—designed for precision, durability, and superior shielding performance in complex applications. Whether you're tackling unique design challenges or optimizing your system's EMI protection, our solutions are tailored to meet your needs.

Talk to one of our expert engineers today to learn how these innovations can elevate your designs and solve your toughest EMI challenges.

Blog by Maya Kurzman, Product Design Engineer, Parker Chomerics

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EMI Shielding Technology Applications in Defense Systems

As the defense industry continues to push the boundaries on advanced electronic systems and state-of-the-art communication devices, the requirements governing these programs must follow suit. Among the many technical requirements is Electromagnetic Compatibility, defined as the ability of a device to withstand both anticipated and unanticipated electronic interference (EMI) as well as minimize the interference being radiated.

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