A contract computer manufacturer is using an existing handmade Kapton® copper shield for EMI shielding around a display. This solution is not providing adequate shielding and does not provide dielectric protection around the part.
Parker Chomerics offered an Engineered Laminate solution featuring CBL-XX-3102-2400 material. The copper offers excellent shielding and can be soldered to if necessary. The .0762mm thick PVC provides a thin dielectric for easier folds and is still UL 94-V0.
The part has PSA tape along the material flow axis of our rotary die cutting machine, so product throughput is high and the customer gets the adhesive they requested.
Parker Chomerics Engineered Laminate solution featuring CBL-XX-3102-2400 material provided the contract computer manufacturer exactly what they required.
The laminate has pressure sensitive adhesive (PSA) for ease of application and can be soldered if necessary. The part can also be cut on a high speed rotary die cut machine for increased material yield and stable labor costs.
Parker Chomerics Engineered Laminates are custom products that combine electrically conductive materials with dielectric insulators to provide EMI shielding, ground paths, and electrical isolation. Learn more.
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Major telecom providers are working hard to overcome a range of technical challenges to deliver on 5G’s potential. One of the outcomes of this work will be a higher number of components in more compact spaces, which in turn prompts the need for effective electromagnetic compatibility (EMC) and thermal management solutions.
With unprecedented advancements in the areas of Internet of Things (IoT), Artificial Intelligence (AI), Big Data, Edge Computing, Cloud Computing, and 5G/Network Infrastructure, telecommunications companies are constantly working to improve hardware solutions and meet the demands of the next generation of connectivity needs.
Parker Chomerics is a leader in the development and manufacture of Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI) shielding solutions as well as Thermal Interface Materials (TIMs) for high performance electronics. In this webinar, you will learn about the component-level and system-level solutions for addressing EMI/RFI shielding and thermal management challenges within telecom hardware. You'll also learn about material advancement and testing trends associated with mmWave technology demands.
With more than 60 years of experience, we have the technical know-how to meet the rapidly increasing needs of engineers.