Component Manufacturer Required a Complete EMI Shielding Solution for Cover

Parker Chomerics mechanical and application engineers, together with the customer’s engineering team, worked to design a model of the radar sensor housing, the RF shield and the radome to meet the customer’s stringent requirements. 

It was determined that the housing could be either molded from Parker Chomerics PREMIERTM PBT-225 Electrically Conductive Plastic, or, as in this case, traditional thermoplastic with an added electrically conductive coating on the inside of the housing. 

The housing assembly design featured EMI shielding and thermal interface materials, an RF absorber, and a radome cover material suitable for laser welding.

During the design process, a finite element analysis (FEA) simulation was conducted to predict the reacting force of the EMI gasket around the 6-pin connector, the EMI gasket around the RF shield during installation into the housing, and the reacting force of the dispensable thermal interface material (TIM) during and after its installation.

The engineering team had to ensure that the targeted dispense location of the TIM would not cause deformation and/or damage to the PCB/IC during and after assembly. 

Parker Chomerics offered a low cost aluminum cover as well as introduced the customer to PREMIERTM PBT-225 Electrically Conductive plastic as a potential solution. This material has woven electrically conductive fibers dispersed in the resin which makes light-weighting and metal-to-plastic conversion possible.

Parker Chomerics also suggested CHOFORM® 5526 Form-in-Place EMI gaskets, dispensed robotically to provide shielding between the cover and PCB trace.

And lastly, the need RF absorption by offering CHO-MUTE® 9025 material with a pressure sensitive adhesive (PSA) that can be easily applied.