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5G Thermal Management Customer Challenge
A global manufacturer of 5G telecom base stations required a high thermal conductivity dispensable thermal interface material (TIM) for increased heat dissipation required to support the capacity and connectivity for future traffic growth.
5G is enabled by high-powered, yet smaller-footprint devices which require the highest performing TIMs. The customer determined that a high-volume, robotically dispensable TIM was necessary that was rated to at least 7 W/m-K thermal conductivity and could withstand a wide range of temperature cycling as well as heat and humidity aging.
Critical Thermal Design Requirements
- Easy to dispense, no curing
- Low stress on sensitive antenna components
- Provide proper thermal dissipation
- Single component material
- Skin-free for 60 hours after dispensing
- Large vessel size for high volume automated dispensing
Key Customer Specific Requirements
- High thermal conductivity, at least 7 W/m-K
- Dispense solution (vendor, equipment)
- No change in thermal or mechanical properties after cycling to -40°C to 125°C
5G Thermal Interface Material Solution
The customer was able to share a sample printed circuit board design with Parker Chomerics, which was then replicated by our experienced Applications Engineering team using an in-house 3D printer.
The 3D printed prototype parts enhances the five locations for dispensing, so that they could be correctly identified for precise dispense location.
Utilizing a dispensing system from our state-of-the-art applications engineering lab in Woburn, MA, THERM-A-GAP GEL 75 was selected for its high thermal conductivity and dispensed onto the 3D printed parts for trials and capabilities. The prototype parts were successful in representing the actual PCB.
The customer visited the applications lab to view the dispensing and determined that THERM-A-GAP GEL 75 would be ideal for their high-volume program.
Conclusion and Summary
Parker Chomerics selected THERM-A-GAP GEL 75 due to its combination of high thermal performance as well as its ability to be dispensed onto the complex parts with ease. Make the switch from thermal gap pads to a cost effective automated or semi-automated installation of thermal interface materials.
With our application engineering team's expertise in 3D printing prototype parts, along with our engineering lab which customers are encouraged to utilize, allowed the Parker Chomerics team to successfully provide a full solution to the customer within one week of receiving the customer's parts for trials.
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THERM-A-GAP GEL 75 Thermally Conductive Gel
Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system. Learn more.
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Solving the Problems that Advanced 5G Presents
There’s a lot riding on advanced 5G applications, and it’s crucial that the thermal products used within them can be counted on for the long haul. That’s why all products from Parker Chomerics endure high-frequency testing at 5G wavelengths and beyond. We don’t leave it up to our customers to figure out if things will work; we give them data based on 3GPP standards so they can make informed decisions for their applications.
Peace of mind – that’s the Parker Chomerics advantage.
Webinar: EMI Shielding and Thermal Interface Solutions for Telecommunications Applications
With unprecedented advancements in the areas of Internet of Things (IoT), Artificial Intelligence (AI), Big Data, Edge Computing, Cloud Computing, and 5G/Network Infrastructure, telecommunications companies are constantly working to improve hardware solutions and meet the demands of the next generation of connectivity needs.
Parker Chomerics is a leader in the development and manufacture of Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI) shielding solutions as well as Thermal Interface Materials (TIMs) for high performance electronics. In this webinar, you will learn about the component-level and system-level solutions for addressing EMI/RFI shielding and thermal management challenges within telecom hardware. You'll also learn about material advancement and testing trends associated with mmWave technology demands.
How to EMI Shield Servers and Data Centers
From facilitating modern conveniences to ensuring mission-critical information exchanges, keeping data centers and servers operating at their best is a top organizational priority. Learn about electromagnetic interference (EMI) solutions for these applications.
Thermal Interface Materials & EMI Shielding Solutions
With more than 60 years of experience, we have the technical know-how to meet the rapidly increasing needs of engineers.
