Advanced electromagnetic interference (EMI) shielding and thermal interface materials are necessary to keep these applications safely working at their best, and Parker Chomerics has a wide range of reliable solutions that work across the entire device.
Our advanced EMI shielding solutions for air vents enhance thermal management in data centers by ensuring efficient airflow while protecting sensitive equipment from electromagnetic interference.
Our enhanced EMI shielding solutions for high-speed cables and connectors ensure optimal performance and signal integrity in demanding environments.
We provide high-performing and reliable thermal interface materials and EMI shielding solutions to help our customers solve difficult problems and support them every step of the way with engineering expertise.
From facilitating modern conveniences to ensuring mission-critical information exchanges, keeping data centers and servers operating at their best is a top organizational priority. Learn about electromagnetic interference (EMI) solutions for these applications.
Parker Chomerics offers the products, technical know-how, customer support and supply chain capabilities to meet your challenges and deliver superior, reliable and cost-effective solutions.
Parker Chomerics THERM-A-GAP™ PAD 80 Thermally Conductive Gap Filler Pads provide a low hardness (35 Shore 00) solution with 8.3 W/m-K of thermal conductivity. Learn more.
Major telecom providers are working hard to overcome a range of technical challenges to deliver on 5G’s potential. One of the outcomes of this work will be a higher number of components in more compact spaces, which in turn prompts the need for effective electromagnetic compatibility (EMC) and thermal management solutions.
With unprecedented advancements in the areas of Internet of Things (IoT), Artificial Intelligence (AI), Big Data, Edge Computing, Cloud Computing, and 5G/Network Infrastructure, telecommunications companies are constantly working to improve hardware solutions and meet the demands of the next generation of connectivity needs.
Parker Chomerics is a leader in the development and manufacture of Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI) shielding solutions as well as Thermal Interface Materials (TIMs) for high performance electronics. In this webinar, you will learn about the component-level and system-level solutions for addressing EMI/RFI shielding and thermal management challenges within telecom hardware. You'll also learn about material advancement and testing trends associated with mmWave technology demands.
Parker Chomerics family of SOFT-SHIELD fabric-over-foam electromagnetic interference (EMI) shielding gaskets provides an EMI gasket solution suitable for most all indoor EMI shielding and grounding applications. Ideal for applications requiring low compression force, these products rely on the unique construction of a conductive plated fabric or wire mesh, wrapped or knitted over a low closure force urethane foam.
Parker Chomerics is a manufacturer of electrically and thermally conductive materials used to solve the challenges associated with these design concerns.
A global manufacturer of 5G telecom base stations required effective thermal management using a high thermal conductivity dispensable thermal interface material to support increased capacity and connectivity for future traffic growth.
New from Parker Chomerics is the THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pad
THERM-A-GAP™ PAD 80, the highest performing gap pad from Parker Chomerics