As the automotive industry advances toward automated, connected vehicles, engineers face the challenge of integrating technologies capable of processing vast data volumes in real-time without significantly increasing vehicle costs. Level-5 autonomous driving requires radar, LiDAR, video cameras, and high-performance onboard computer systems, but accommodating these components generates electromagnetic interference (EMI) and excess heat, hindering connectivity and safety. Parker addresses these challenges with innovative shields and thermal management technologies, effectively containing electromagnetic noise and dissipating heat from critical components, ensuring seamless integration of advanced connectivity and safety features in vehicles.
Thermal Interface Material
Thermal Interface Material
Form-in-Place EMI gasket
With the introduction of Advanced Driver Assistance Systems (ADAS) and other semi-autonomous driving technologies, a different concept of the vehicle is emerging. In the future, the car will be a media playback center, telephone, office, and extension of the home’s living room which also happens to be able to convey passengers from A to B.
Discover three challenges a global automotive supplier faced when designing an integrated gauge cluster assembly on an aluminum die cast housing, delivered as a single assembly for instrument cluster module.
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To perform safely and efficiently, high-torque electric motors require integrated cooling systems that are up to the challenge. Plastic components provide Original Equipment Manufacturers (OEMs) with a low-cost, space-saving solution to this engineering test, and with built-in machine-based process monitoring, they can rest assured that each manufacturing and assembly step is completed thoroughly and correctly.
Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications. These novel products continue to expand the portfolio of high performance, high reliability thermal gap pads and dispensable thermal gels.