Semiconductor Packaging Materials

Our die attach materials bond components to lead frames, or directly to the interposer and other substrates. This product line offers many solutions depending on your needs for mechanical strength, electrical conductivity, and heat dissipation. Common types of packages that use die attach adhesives are dual-in-line (DIP), small-outline integrated-circuit (SOIC), quad flat pack (QFP), and chip-on-board (COB). These adhesives can be dispensed, printed, or applied by pin transfer in a variety of patterns.

Encapsulants are designed for use in the encapsulation of wire-bonded or in components that require environmental protection or enhanced reliability. Our semiconductor-grade encapsulants with high purity are used for glop tip, dam, and fill or onboard module encapsulation. 

Our capillary underfill encapsulants are high-purity, semiconductor-grade epoxies developed for the encapsulation of flip chip devices, chip-scale package (CSP) and ball grid array (BGA) components. They are formulated for low standoff and fine pitch interconnections to enhance the reliabilities of the drop and temperature cycle. These materials are engineered to withstand 260°C peak reflow temperatures of lead-free solders.

Gels and greases are designed for applications where a thermal interface material is required. Our gels are formulated to inhibit bleed, separation and pump-out that are typically observed in other thermal interface materials. Greases are designed for when the heat sink may later need to be easily removed from the device. These products provide efficient heat transfer from flip chip microprocessors, plastic pin-grade arrays (PPGAs), ball grid arrays (BGAs), micro BGA's, digital signal processing chips (DSP), graphic accelerator chips and other high-wattage electronic components.