We specialize in developing world-class thermal management, semiconductor packing, potting, and thick film materials for electronic applications. Our product portfolio and technical expertise include multiple chemistries, namely urethanes, epoxies, and silicones. This product and expertise diversity allows us to select the chemistry that is the best fit for our customers' performance and cost requirements.
With applications in heat sinks, circuit boards, and a wide variety of other electronic devices, our solutions provide electrical insulation, structural strength and protection.
Transfer heat out of electronic devices and protect sensitive electronics with thermally conductive adhesives, gap fillers and foams.
Optimize heat dissipation with thermally conductive, low-viscosity potting and encapsulants for electronic applications.
Die attach adhesives, encapsulants, underfills and thermal interface materials for assembly and packaging.
Trust in durable, electrically conductive thick film materials for electronic applications.
Expect the Same Level Quality Around the Globe
We provide products and services that consistently meet customer expectations of quality and value. A central element of our culture is an unwavering commitment to quality and continuous improvement. Our thermal management team is certified and registered to ISO 9001 and IATF 16949 which guides our focus on producing the highest quality products.
We Are, Where You Are
As electric vehicle platforms ramp up, so do our customer's expectations of an ideal supplier. You expect high performance and consistent quality from your suppliers and this is where we thrive. We have manufacturing facilities around the world that follow standardized processes for material development, which enables us to get you products in a timely and cost-effective manner. We've expanded our capabilities to manufacture in China, Europe, and the United States.
Back to Basics
An electronic adhesive is a type of adhesive or glue that is specifically designed for use in electronic applications. These adhesives are used to bond electronic components and devices together, as well as to provide electrical insulation and thermal management. Electronic adhesives are typically formulated to provide durable bonds that can withstand the stresses of temperature changes, vibration, and other environmental factors. Often, they are designed to provide specific properties, such as electrical conductivity or thermal conductivity, depending on the application.
We work with our customers to deliver the best thermal management products for complex applications, moving with speed and agility to create highly-engineered solutions for electronic assembly applications and EVs. Learn more in our brochure.
Electric vehicles - including automobiles, buses, trains, off-road vehicles, watercraft, and aircraft are here to stay. A key challenge in developing higher-power-density electronics for electric vehicles and other applications is to manage the heat. This e-book covers topics crucial to thermal management in your applications.
A study is conducted to compare thermal performance in battery modules using different thermal interface materials (TIMs) to connect the battery cells to a cooling plate. CoolTherm® liquid-dispense gap fillers are compared with thermal gap pads of comparable thermal conductivity.
Thermal Management involves the use of materials to transfer heat away from something hot so that it continues to function properly. Learn how thermal management, is particularly important for electronics to combat high temperatures.
Learn more about gap fillers, a thermal interface material, to displace the air and fill in the gaps between the two substrates and the numerous chemistries available.
Learn more about the terms that you need to know about thermal management - pot life, viscosity, specific gravity, and more.
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