Bioscience and Water Filtration Division

Bioscience and Water Filtration Division - ECD copper plating
679945:MARKETS

ECD copper plating

Electrochemical deposition copper plating is a highly efficient wet process for depositing a very thin uniform layer of copper on to the surface of the wafer. Plating chemistries are copper sulfate with additives (organic suppressors and accelerators) and process temperatures are low.  In this application, filters that are hydrophilic (require no wetting) are typically used to achieve the best process results.

 

Parker's Clariflow (hydrophilic PES membrane) and Proflow (hydrophilic PTFE) are filters which do not require wetting and are highly compatible with most copper plating solutions. These filters are available in different lengths to fit both higher flow recirculated plating processes and well as low flow single wafer plating applications.

 


 

Products for ECD copper plating

  • Download literature using the product links below

    ECD COPPER PLATING

    HDPE Structure

    Chemflow-PE Select Cartridge Filter

    0.03 | 0.05 | 0.1 | 0.2 | 1.0 µm

    Chemically resistant HDPE/PTFE with innovative
    SELECT pleating technology to provide
    outstanding flow.

    Chemflow-XF Cartridge Filter

    0.03 | 0.05 | 0.1 µm

    Chemically resistant HDPE/PTFE for recirculated
    applications under 60°C

    Polypropylene (PP) Structure

    Clariflow-E Select Cartridge Filter

    0.02 | 0.04 | 0.1 | 0.2 µm

    Unique hydrophilic PES mirrored anisotropic
    membrane and high-purity, all polypropylene
    support structure with innovative SELECT pleating
    technology for increased flow.

    Proflow-HE Select Cartridge Filter

    0.05 | 0.1 | 0.2 | 0.5 | 1.0 | 3.0 | 10.0 µm

    Chemically-resistant polypropylene structure with
    hydrophilic SELECT pleated PTFE membrane.
    Ideal for most dilute acids and bases.

GLOBAL CONTACT
Parker Bioscience Filtration

+1 805 604 3400
+1 877 784 2234

bioscience.na@parker.com

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