


Explore our microelectronics solutions. If you need help choosing one of our standard microelectronic products or if they don’t quite meet your needs, let us help you determine an appropriate solution for your application.

We offer potting & encapsulants that are thermally conductive for applications where you need to remove heat, as well as non-thermally conductive materials.

Our data show a clear advantage for liquid-dispensed gap fillers versus thermal gap pads when removing heat from battery modules. Learn from our experts in our latest white paper which compares gap filler and thermal pad performance on a prototype electric vehicle battery module.