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THERM-A-GAP™ 569, 570, 579 and 580 materials are the result of Chomerics continuing product improvements. 570 and 580 represent a significant improvement in thermal performance and conformability over previous gap fillers and have rapidly achieved industry wide acceptance.

All four products are available on aluminum foil (A) or on “clean break” glass (G) fiber carrier. As with all previous Chomerics gap-fillers, the A versions have a high strength acrylic pressure sensitive adhesive for permanent attachment to the cold surfaces.

THERM-A-GAP G974 thermally conductive interface pads are designed for use between heat generating components and their heat sinks. G974 material conforms to surface irregularities under moderate application pressures to fill air gaps and enhance heat transfer. It has a high thermal conductivity of 4.0 W/m-K. Pads range in thickness from 0.010 to 0.060 in. (0.25 to 1.5 mm). They include a fiberglass carrier for added strength during assembly and rework. G974 material is an electrically non-conductive, boron-nitride-filled silicone elastomer best suited for applications with pressures from 5 to 100 psi (0.03-0.69 MPa), and where high thermal performance is needed.

THERM-A-GAP 174, 274, and 574 - thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates.

THERM-A-GAP A174 materials are suited for high volume, low cost applications, such as in automotive electronics, laptop PCs,etc.

THERM-A-GAP A274 materials can be molded to meet exact dimensions required for optimum electronics packaging.

 materials are ideal for heat flux typical of microprocessors, video chips and power semiconductors.

Download the Thermal Interface Materials, Product Catalog(.pdf)