Parker’s Thermal Management offering of thermal compounds, pads and heat transfer systems keep heat away from processing systems in high heat applications. As medical equipment, power electronics and other high heat applications become faster and included in smaller devices, the demand for Thermal Management products and heat transfer compounds increases. Parker thermal interface materials are inserted between electronic components and heat sinks to aid heat flow. Chomerics is a highly recognized brand name in thermal management.
Parker Thermal Management products include:
- Gap fillers, gap pads, phase change materials, dispensed greases and gels, silicone-free thermal pads & insulator pads
- Thermal compounds, flexible heat spreaders
- Polymer solder hybrids & custom integrated thermal assemblies
- A Pumped Liquid Multi-phase Cooling (PLMC) system which uses refrigerant instead of water to cool high heat generating electronic systems
- A spray cooling system that uses coldplate cooling systems, smart pumps and macrospray nozzles
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Parker thermal management benefits
Parker thermal management products protect some of the most sensitive microprocessors found in:
- Computers, telecommunications equipment & cellular handsets
- Consumer and automotive electronics
- Memory modules and lasers
- Vibration dampening in motors and engine controllers
- Power electronics, point-of-load converters & power distribution
- Hybrid and electric vehicles in military and aerospace applications
- Medical imaging equipment
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Thermal Management Product Offerings from Parker Filler materials include:
- Alumina
- Aluminum oxide
- Boron nitride
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To learn more about Parker thermal management, email us at c-parker@parker.com. |
